Special Issue on The Implementation of Artificial Intelligence by Computer Assistance on Industrial and Manufacturing Systems Engineering

Submission Deadline: Mar. 30, 2020

This special issue currently is open for paper submission and guest editor application.

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Special Issue Flyer (PDF)

  • Special Issue Editor
    • Bloul Benattia
      Hydrocarbon Transportation Department, University M’hammed Bougara of Boumerdes, Boumerdes, Algeria
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to fulfill the Guest Editor application.
    • Aour Benaoumeur
      Department of Mechanical Engineering, LABAB Laboratory, National Polytechnic School of Oran, Maurice Audin, Algeria
    • Chanal Hélène
      Université Clermont Auvergne, CNRS, SIGMA Clermont, Institut Pascal, AUBIERE, Auvergne Rhône Alpes, France
    • Aour Benaoumeur
      Department of Mechanical Engineering, National Polytechnic School of Oran-Algeria, Algiers, Algeria
    • Bourdim Mokhtar
      Department of Mechanical Engineering, Institute of Science and Technology, Ahmed Zabana University, Relizane, Algeria
    • Maalej Yamen
      Department of Mechanical Engineering, National Engineers School of Tunis, El Manar, Tunisia
    • Haridy Manal
      Department of Physics, University of Hail, Ha'il, Saudi Arabia
    • Magibalan S
      Department of Mechanical, K.S.R College of Engineering, Namakkal, Tamilnadu, India
  • Introduction

    This special issue will bring together diverse stakeholders to respond to a call for action in the areas of research and technology, views on gaps, challenges, opportunities and disruptive technologies in the transition of research towards technology, product and market. First of all, the advent of computer technology is accelerating development and spread of technology including advanced technology, metamaterials, nanotechnology, robotics, three-dimensional measurement. This allows to introduce advanced neural network systems into each phase in these areas. Over the last decade, the application of artificial neural networks to solving engineering problems has grown enormously. Recently, the synergy achieved by combining the two techniques has become increasingly apparent. Although many studies are available to present potential users of artificial neural networks, there are few that deal with combinations of this subject and few are those that present to the reader with the practical aspects of implementation. Indeed, we have considered treating these aspects in this special issue in order to properly circumvent these problems and present an appropriate solution through specific scientific papers.

    Aims and Scope:

    1. Dimensional metrology
    2. Geometric surface treatment
    3. Measurement and advanced artificial intelligence
    4. Computer aided design and edge computing for sensors
    5. CNC machine tools and machinery artificial intelligence
    6. Applied biomechanics

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.ijimse.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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